ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,797, issued on April 21, was assigned to Powerchip Semiconductor Manufacturing Corp. (Hsinchu, Taiwan). "Wafer stacking process" was inven... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,799, issued on April 21, was assigned to Tencent Technology Co. Ltd. (Shenzhen, China). "Coating method for making chip, chip substrate, a... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,800, issued on April 21, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Method for forming semiconductor device a... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,801, issued on April 21, was assigned to Imec vzw (Leuven, Belgium). "Metallization process for an integrated circuit" was invented by Vic... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,802, issued on April 21, was assigned to CHANGXIN MEMORY TECHNOLOGIES INC. (Hefei City, China). "Method for forming contact structure, sem... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,803, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device structure with reduced cr... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,804, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Contact structure, semiconductor device compri... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,805, issued on April 21, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with polymer liner and me... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,806, issued on April 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Interconnect structures with nitrogen-rich dielectric materia... Read More
ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,807, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea). "Integrated circuit devices including a back side pow... Read More